Triaxial High Performance High Frequency MEMS Shock Sensor Used in Harsh Environment SS301
SS301 Piezoresistive shock accelerometers is manufactured by
SkyMEMS , it is a compact, factory calibrated 3 axis device based
on piezoresistive technology. It uses micro-electromechanical
systems (MEMS) technology, in which all structural and electronic
components are manufactured in silicon using electronic
microfabrication technologies. it enjoys large range, small size,
high reliability, high stability, high accuracy, low temperature
drift, and strong adjustment in harsh environment.
this product is an ideal option for high shock parameter
SkyMEMS 3-axis Shock Sensor 2016.pdf
- 3-axis MEMS shock accelerometer, IP67 protection
- Packaged and SMT configurations
- Large shock range
- Excellent amplitude linearity
- Low power consumption
- Advanced MEMS Sensing Element
- Qualified for Critical Safety Avionics Application
- Individually calibrated, real actual precision
- Extremely reliable in Harsh environment
- Screw Mount
- Low Cost
SS301 MEMS Shock Sensor can measures the high G shock, it has been
widely applied in the following solutions, such as:
- Metal-to-metal impact & pyroshock
- Crash Testing
- Vibration & Shock Monitoring
- Impact Testing
- Data recorders, penetrator & launch tests
- Consumer electronics drop testing
- Blast loading & survivability of structures
- Fuze, safe and arm
|3-axis Shock Sensor|
|3-axis Shock Converter|
|Frequency Characteristic||20~5kHz in-band roughness≤1dB, out-of-band attenuation>45dB|
|Dynamic Output Voltage(V)||0.2±0.2~4.8±0.2|
|Current(mA)||+15V ≤60, -15V ≤60|
|Connector Type||the sensor connects with the converter through cable GM5-ZBF-X, the
converter's output connecter: J30J-9ZKP|
High Performance Piezoresistive MEMS Shock Sensor
- Highly accurate, reliable and temperature stable
- Environmentally sealed (IP67), compact design
- Low power consumption
- Full tests and individual calibration from -40 to 60°C
- High cost effective
What is Attributes of Sensors ?
Operating Principle: Embedded technologies that make sensors function, such as
electro-optics, electromagnetic, piezoelectricity, active and
Dimension of Variables: The number of dimensions of physical variables.
Size: The physical volume of sensors.
Data Format: The measuring feature of data in time; continuous or
discrete/analog or digital.
Intelligence: Capabilities of on-board data processing and decision-making.
Active versus Passive Sensors: Capability of generating vs. just receiving signals.
Physical Contact: The way sensors observe the disturbance in environment.
Environmental durability: will the sensor robust enough for its operation conditions